The innovation in the cooling of processors from High-End PC systems and game consoles with a heat conduction pad!
The Coollaboratory Liquid MetalPad ist the first heat conduction pad, which is composed of 100% metal and melts with just less heating (BurnIn-process), then it confects its superior heat transfer. It dissipates the heat fast and efficiently and needn´t hide from the best heat conduction paste. The simple, clean and fast installation turns the Liquid MetalPad into the ultimate heat conduction medium for HighEnd PCs and game consoles.
The Liquid MetalPad can be used with all on the cooling market commercially available materials, for instance aluminum or copper! It doesn´t age and doesn´t have to exchange regular. The Coollaboratory Liquid MetalPad is certainly RoHS conformable and absolute nontoxic.
The Coollaboratory Liquid MetalPad for notebooks is esspecially developed for the usage in mobile prcessors as there are often bigger gaps to fil up between the contact surfaces. The set is delivered in a transparent blister-package, a detailed printed manual and contains one Liquid MetalPad (approx.76x38mm) and two copper foils (in 76×38 mm and 0,1mm and 0,2 mm thickness). Additionally there is a cleaning set with a cleaning tissue for cleaning of the contact area before and using the Liquid MetalPad.
AWARDS OF COOLLABORATORY LIQUID METALPAD
Coollaboratory Liquid MetalPad earns already over 30 awards of worldwide recognized and objective web- and print magazines. It demonstrates the absolute reference of heat conduction pads on the High-End market for PC systems and game consoles and is a fundamental part for very quiet Silent-PCs or extreme Performance-systems. Read the impressions objective tester and assure yourself of the fact of the quality and capacity of the Coollaboratory Liquid MetalPad.
|Manual||English | German | French | Japanese | Russian | Spanish | Chinese|
|Safety data sheet||English | German|
|Declaration of conformity||English | German|